All Results (1,058)

Select Image Part # Mfr. Description Datasheet Availability Pricing (INR) Filter the results in the table by unit price based on your quantity. Qty. RoHS
JUMPtec Computer-On-Modules - COM JUMPtec COMe-mAL10 E2 E3950 8E
27In Stock
18On Order
Min.: 1
Mult.: 1
JUMPtec Computer-On-Modules - COM JUMPtec COMe-bBD7R E2 D-1539 10G-KR
11In Stock
Min.: 1
Mult.: 1
JUMPtec Computer-On-Modules - COM JUMPtec COMe-mBTi10 E3827 2GB
40In Stock
Min.: 1
Mult.: 1


congatec CPU & Chip Coolers Passive cooling solution for SMARC module conga-SMX8-Plus with NXP i.MX 8M Plus ARM processor. All standoffs are with 2.7mm bore hole.
8In Stock
5On Order
Min.: 1
Mult.: 1

congatec Development Boards & Kits - x86 3.5 Carrier Board for SMARC 2.0 modules with x86 CPUDimensions are 146mm x 102 mm (5.74" x 4.02")Operating Temperature: 0 C to 60 C (commercial)
23In Stock
14On Order
Min.: 1
Mult.: 1

congatec Computer-On-Modules - COM COM-HPC Size D module based on Intel Xeon D1712TR 4-core processor with tbd GHz, 10MB cache and dual channel DDR4 2666 MT/s memory interface (formerly Ice Lake-D LCC). Commercial temperature range.
1In Stock
Min.: 1
Mult.: 1
congatec Computer-On-Modules - COM QSEVEN INTEL ATOM E3845 BAY TRAIL
6In Stock
6On Order
Min.: 1
Mult.: 1

congatec Development Boards & Kits - x86 EVALUATION CARRIER BRD COM EXP TYPE 10
3In Stock
Min.: 1
Mult.: 1

congatec Computer-On-Modules - COM Qseven 2.0 module based on Intel Atom x7 E3950 SoC (Itemp Quad-core, 12W TDP, CPU freq. 1.6/2.0GHz, GPU 18EU freq. 500/650MHz) with on-board memory 8GB DDR3L-1866 and 32GB eMMC.
4In Stock
3On Order
Min.: 1
Mult.: 1

JUMPtec Heat Sinks HSP COMe-mAL10 E2 through
55In Stock
Min.: 1
Mult.: 1
JUMPtec Heat Sinks HSP COMe-bSL6 Cu-core threaded 47In Stock
Min.: 1
Mult.: 1
JUMPtec Development Boards & Kits - ARM SMARC Evaluation Carrier 2.0
3In Stock
Min.: 1
Mult.: 1

congatec Heat Sinks Standard passive cooling for Qseven module conga-QA3. All stand-offs are M2.5 threaded.
87In Stock
Min.: 1
Mult.: 1

congatec Computer-On-Modules - COM COM Express Type 6 Compact module with Intel Celeron 3955U dual core processor with 2.0GHz, 2MB L2 cache, 2133MT/s dual channel DDR4 memory interface
95In Stock
Min.: 1
Mult.: 1

congatec Computer-On-Modules - COM COM Express Type 6 Compact module with Intel Core i3-7100U dual core processor with 2.4GHz, 3MB Intel Smart Cache , GT2 graphics and 2133MT/s dual channel DDR4 memory interface (Intel Kaby Lake-U).
19In Stock
Min.: 1
Mult.: 1

congatec Computer-On-Modules - COM Qseven module with Intel Atom E3845 quad core processor with 1.91GHz, 2MB L2 cache, 4GB 1333MT/s DDR3L onboard dual channel memory. No onboard eMMC.
9In Stock
Min.: 1
Mult.: 1



congatec Heat Sinks Heat spreader solution for SMARC module conga-SMX8-X with lidded NXP i.MX 8X ARM processor. All standoffs are with 2.7mm bore hole.
8In Stock
Min.: 1
Mult.: 1

congatec Computer-On-Modules - COM QSEVEN INTEL ATOM E3815 BAY TRAIL
35In Stock
Min.: 1
Mult.: 1

JUMPtec Heat Sinks HSP COMe-mAL10 E2 slim thread
64In Stock
Min.: 1
Mult.: 1
JUMPtec Development Boards & Kits - x86 COMe Eval Carrier 2 T10
3In Stock
Min.: 1
Mult.: 1
congatec Development Boards & Kits - ARM 3.5 Carrier Board for SMARC 2.0 modules with ARMDimensions are 146mm x 102 mm (5.74" x 4.02")Operating Temperature: 0 C to 60 C (commercial)
27In Stock
Min.: 1
Mult.: 1

congatec Computer-On-Modules - COM COM Express Type 6 Compact module based on Intel Core i7-8665UE 4-core processor with 1.7GHz up to 4.4GHz turbo boost, 8MB L2 cache, Intel UHD Graphics 620 and dual channel DDR4 2400 MT/s memory interface (formerly Whiskey Lake).
1In Stock
Min.: 1
Mult.: 1

congatec Computer-On-Modules - COM COM-HPC client module based on Intel Xeon Processor W-11865MLE 8-core processor with 1.5GHz up to 4.5GHz turbo boost, 24MB Intel Smart Cache, Intel UHD Graphics and dual channel DDR4 3200 MT/s memory interface (formerly Tiger Lake-H) with Chipset
1In Stock
Min.: 1
Mult.: 1

JUMPtec Development Boards & Kits - x86 COMe Eval Carrier T7
11In Stock
Min.: 1
Mult.: 1
congatec Heat Sinks Standard heatspreader (Heatstack Solution) for Qseven module conga-QMX6 with CPU in NON-LIDDED FCBGA Package.Threaded version (standoffs, M2.5)Intended for following QMX6 modules: * conga-QMX6/DC-1G eMMC4 (P/N 016102A) * conga-QMX6/QC-1G eMMC4 (P/N 0 154In Stock
Min.: 1
Mult.: 1