DF200R07W2H3B77BPSA1

Infineon Technologies
726-DF200R07W2H3B77B
DF200R07W2H3B77BPSA1

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Description:
IGBT Modules EASY

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In Stock: 2

Stock:
2 Can Dispatch Immediately
Factory Lead Time:
10 Weeks Estimated factory production time for quantities greater than shown.
Minimum: 1   Multiples: 1
Unit Price:
₹-.--
Ext. Price:
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Pricing (INR)

Qty. Unit Price
Ext. Price
₹4,698.00 ₹4,698.00
₹3,955.02 ₹39,550.20

Product Attribute Attribute Value Select Attribute
Infineon
Product Category: IGBT Modules
IGBT Silicon Modules
3-Phase Inverter
650 V
1.46 V
100 A
100 nA
- 40 C
+ 150 C
Tray
Brand: Infineon Technologies
Country of Assembly: Not Available
Country of Diffusion: Not Available
Country of Origin: CO
Product Type: IGBT Modules
Series: EasyPACK 2B
Factory Pack Quantity: 15
Subcategory: IGBTs
Technology: Si
Tradename: EasyPACK
Part # Aliases: DF200R07W2H3_B77 SP005423521
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USHTS:
8541290065
TARIC:
8541290000
ECCN:
EAR99

EasyPACK™ 2B IGBT Power Modules

Infineon Technologies EasyPACK™ 2B IGBT Power Modules are a scalable power module solution with a flexible pin grid system perfect for customizing layout and pinout. The packages do not have a base plate, enabling use in various applications. In PIM or Six-Pack configurations, the Infineon EasyPACK 2B IGBT power modules cover the full power range from 20A to 200A at 600V/650V/1200V. These modules also have a power dissipation range from 20mW to 600W and operate from -40°C up to +150°C or +175°C.

Reliable & Efficient Power Supply for Data Centers

Infineon Technologies Reliable and Efficient Power Supply for Data Centers are scalable solutions with power ratings from approximately 5kW to 50/60kW. This Infineon solution is ideal for uninterruptible power supplies (UPS) that require high power density and energy efficiency. These modules leverage various chip technologies, including Si IGBT, CoolSiC™ hybrid, and CoolSiC MOSFET, to meet diverse requirements for cost-effectiveness and performance. Infineon's portfolio addresses all system levels of a UPS with different voltage classes, and are set to expand offerings to include lower power rating classes.

650V 3-level IGBT Modules

Infineon Technologies 650V 3-level IGBT Modules are EasyPACK™ modules with Trench/Fieldstop technology. These modules feature low inductive design, low switching losses, and low VCE(sat). The IGBT modules provide Al2O3 substrate with low thermal resistance, compact design, PressFIT contact technology, and rugged mounting due to integrated mounting clamps. Potential applications include three-level applications, motor drives, solar applications, and UPS systems in EasyPACK™ modules.

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