FDMS86500DC

Dual Cool™ MOSFETs

onsemi Dual Cool™ PowerTrench® MOSFETs provide Dual Cool packaging technology that features bottom- and top-side cooling in a PQFN package. The PQFN footprint is an industry standard and provides performance flexibility for the designer. The Dual Cool MOSFETs feature enhanced dual path thermal performance and improved parasitics over wire-bonded predecessors. The use of a heat sink with Dual Cool packaging technology provides even more impressive results. When a heat sink is used with onsemi Dual Cool package technology, synchronous buck converters deliver higher output current and increased power density.

Fairchild PowerTrench MOSFETs

N-Channel Dual Cool PowerTrench® MOSFET

The FDMS86101DC and FMDS83500DC N-Channel Dual Cool™ PowerTrench® MOSFETs are produced using onsemi's advanced PowerTrench® process. Advancements in both silicon and Dual Cool™ package technologies have been combined to offer the lowest R_DS(ON) while maintaining excellent switching performance by extremely low Junction-to-Ambient thermal resistance. Typical applications for these items include primary DC-DC MOSFET, secondary synchronous rectifier, load switch, telecom secondary side rectification and high end server/workstation Vcore low side.

PowerTrench® MOSFETs

onsemi PowerTrench^® MOSFETs offer a broad portfolio of MOSFETs in the industry. These onsemi MOSFETs offer N-Channel and P-Channel versions optimized for low R_DS(ON) switching performance and ruggedness. Typical applications include load switches, primary switching, mobile computing, DC-DC converters, and synchronous rectifiers.