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EXPA4M960GB

Name: Exascend EXPA4M960GB
Brand: Exascend
SKU: 245-EXPA4M960GB
Price: 42350.73 INR
Availability: OutOfStock

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Mouser No:

245-EXPA4M960GB

Mfr. No:

EXPA4M960GB

Mfr.:

Exascend

Description:

Solid State Drives - SSD

Datasheet:

EXPA4M960GB Datasheet (PDF)

ECAD Model:

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More Information

Learn more about Exascend EXPA4M960GB

Delivery Alerts:

This item may require additional fees and documentation. Customs delays may also occur.

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Pricing (INR)

Qty.	Unit Price	Ext. Price
	₹42,350.73	₹1,27,052.19
	₹38,939.46	₹3,89,394.60
	₹37,637.94	₹9,40,948.50

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Exascend
Product Category:	Solid State Drives - SSD
Delivery Alerts:	This item may require additional fees and documentation. Customs delays may also occur.
Series:	PA4
Memory Size:	960 GB
Product:	PCIe SSDs
Form Factor:	M.2 2280
Configuration:	3D TLC
Interface Type:	PCIe
Sustained Write:	1800 MB/s
Sustained Read:	3200 MB/s
Operating Supply Voltage:	3.3 V
Minimum Operating Temperature:	- 40 C
Maximum Operating Temperature:	+ 85 C
Dimensions:	80 mm x 22 mm x 3.5 mm
Brand:	Exascend
Connector Type:	M.2
Country of Assembly:	Not Available
Country of Diffusion:	Not Available
Country of Origin:	Not Available
Packaging:	Reel
Product Type:	Solid State Drives - SSD
Factory Pack Quantity:	1
Subcategory:	Memory & Data Storage

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Filter Document:

Datasheet

EXPA4M960GB Datasheet (PDF)

Test/Quality Data

User Guide (PDF)

UK Declaration of Conformity (PDF)

USHTS:: 8523802000
TARIC:: 8523801000

PA4 Series Automotive-Grade SSDs

Exascend PA4 Series Automotive-grade Solid State Drives (SSDs) provide exceptional performance and ultra-high reliability over traditional hard disk drives. These SSDs achieve up to 3500MB/s for a sequential read, 2600MB/s for a sequential write, and 600,000IOPS for a random read process. The PA4 SSDs also achieve 450,000IOPS for a steady-state random write process. These SSDs consist only of semiconductor devices, helping the product to exhibit superior performance, reliability, ruggedness, capability, low power, and small form factor profiles