AF0131CSSM30SMKA1-CP

onsemi
863-131CSSM30SMKA1CP
AF0131CSSM30SMKA1-CP

Mfr.:

Description:
Image Sensors 1MP 1/3 CIS SO

Lifecycle:
New Product:
New from this manufacturer.
ECAD Model:
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This item may require additional fees and documentation. Customs delays may also occur.

Availability

Stock:
3,000 Can Dispatch in 20 Days
Long lead time reported on this product.
Minimum: 3000   Multiples: 3000
Unit Price:
₹-.--
Ext. Price:
₹-.--
Est. Tariff:

Pricing (INR)

Qty. Unit Price
Ext. Price
₹5,213.91 ₹1,56,41,730.00

Alternative Packaging

Packaging:
Tray
Availability:
In Stock
Price:
₹7,011.33
Min:
1

Product Attribute Attribute Value Select Attribute
onsemi
Product Category: Image Sensors
Delivery Restrictions:
 This item may require additional fees and documentation. Customs delays may also occur.
Monochrome
60 fps
3.5 um x 3.5 um
Tray
Brand: onsemi
Country of Assembly: Not Available
Country of Diffusion: Not Available
Country of Origin: TW
Moisture Sensitive: Yes
Optical Format: 1/3 in
Product Type: Image Sensors
Series: AF0131
Factory Pack Quantity: 100
Subcategory: Sensors
Tradename: Hyperlux
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Attributes selected: 0

USHTS:
8541491050
ECCN:
EAR99

AF013x Hyperlux™ ID 1.2MP iToF Sensors

onsemi AF013x Hyperlux™ ID 1.2MP Indirect Time of Flight (iToF) Sensors are matrix sensors for 3D imaging of fast-moving objects. The sensors feature a 1/3.2" optical format and Back-Side Illuminated (BSI) CMOS global shutter depth and imaging. onsemi AF013x iToF image sensors offer on-chip dual laser driver controls, modulation frequencies (up to 200MHz), and laser eye-safety thresholds. The AF0130 sensor version comes with a depth-processing ASIC stacked below its pixel area. This on-chip depth processing ASIC calculates depth, confidence, and intensity maps at high speeds from its laser-modulated exposures. The AF0131 is geared toward designs with off-chip depth calculation. These sensors are ideal for factory automation, computing, drones, robotics, metrology, machine vision, biometrics, future retail and intelligent logistics, and 3D modeling.