TCM0403M-350-2P-T210

TDKcommonmodechoke

TCM-M Common Mode Filters

TDK TCM-M Common Mode Filters are miniaturized thin-film common-mode filters designed for use in mobile devices. These filters reduce intruding noise and improve wireless signal reception sensitivity due to their high common-mode attenuation characteristics. The TCM-M series addresses common challenges such as the deterioration of signal reception sensitivity faced by smartphones, wearables, and other mobile devices. These common-mode filters feature compact dimensions of either 0.45mm x 0.3mm x 0.23mm or 0.65mm x 0.5mm x 0.3mm for ultra-small spaces. With the extended operating temperature range of -25°C to +85°C, these filters are suitable for use in a wide range of temperature environments. TDK TCM-M Common Mode Filters applications include anti-noise measurements for ultra-high speed differential lines (MIPI D-PHY, USB2.0, HDMI, etc.) in mobile devices and general consumer products.

WE-CMB Common Mode Power Line Inductors (Chokes)

Würth Elektronik WE-CMB Common Mode Power Line Inductors (Chokes) feature a compact design that delivers high suppression of asymmetric interferences, even at low-frequency ranges. In addition, these inductors provide broadband screening due to a low capacitance winding technique. Würth Elektronik WE-CMB Common Mode, Power Line Inductors, are ideal for power electronics and suppressing common-mode noises. Parasitics can have a significant effect on the noise attenuation and current rating of a common mode filter. Würth designed the WE-CMB series for minimal parasitic effects over its useful frequency bandwidth so it does what it is designed to do - get rid of the noise.

TCM & MCZ Ultra-Compact Common Mode Chokes

TDK TCM and MCZ wide-band, thin-film, multilayer Common Mode Chokes for EMI suppression are available in several case sizes to accommodate a variety of applications for high-speed data transmission lines. TDK has applied expertise in thin-film magnetic head technology, including original fine pattern conductor formation and film formation technologies, original multilayer structure technologies, and ferrite material technologies.