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HDTM-6-08-1-S-VT-5-R-1

Name: Samtec HDTM-6-08-1-S-VT-5-R-1
Brand: Samtec
SKU: 200-HDTM6081SVT5R1
Price: 1908.78 INR
Availability: OutOfStock

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See Product Specifications

Mouser No:

200-HDTM6081SVT5R1

Mfr. No:

HDTM-6-08-1-S-VT-5-R-1

Mfr.:

Samtec

Description:

High Speed/Modular Connectors XCede(R) HD 1.80 mm High-Density Backplane Vertical Header

Lifecycle:

New Product:

New from this manufacturer.

Datasheet:

HDTM-6-08-1-S-VT-5-R-1 Datasheet (PDF)

ECAD Model:

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More Information

Learn more about Samtec HDTM-6-08-1-S-VT-5-R-1

Availability

Stock:: Non-Stocked

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Factory Lead Time:: 3 Weeks Estimated factory production time.

Enter Quantity:

Minimum: 1 Multiples: 1

Unit Price:

₹-.--

Ext. Price:

₹-.--

Est. Tariff:

Pricing (INR)

Qty.	Unit Price	Ext. Price
	₹1,908.78	₹1,908.78
	₹1,767.84	₹17,678.40
	₹1,626.90	₹48,807.00
	₹1,414.62	₹84,877.20
	₹1,227.57	₹1,47,308.40
	₹1,117.08	₹3,01,611.60
	₹969.18	₹4,94,281.80
	₹822.15	₹8,38,593.00

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Samtec
Product Category:	High Speed/Modular Connectors
Packaging:	Tray
Brand:	Samtec
Country of Assembly:	Not Available
Country of Diffusion:	Not Available
Country of Origin:	CN
Product Type:	High Speed / Modular Connectors
Factory Pack Quantity:	30
Subcategory:	Backplane Connectors

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Datasheet

HDTM-6-08-1-S-VT-5-R-1 Datasheet (PDF)

Conflict Material Declaration (Spreadsheet)

USHTS:: 8536694040
ECCN:: EAR99

XCede® HD High-Density Backplane Systems

Samtec XCede® HD High-Density Backplane Systems combine a small form factor with incredible design flexibility for system and board space savings. These backplane systems allow for creating a fully custom backplane solution with guidance and keying, power modules, and sidewalls for increased durability. Samtec XCede HD backplane systems help prevent system downtime by implementing a staggered differential pin design where the ground pins mate first for hot-plugging. These backplane systems feature a 1.8mm column pitch, up to 3mm contact wipe on signal pins, and multiple signal/ground pin staging options.