HDTM-3-08-1-S-VT-5-R-5

Samtec
200-HDTM3081SVT5R5
HDTM-3-08-1-S-VT-5-R-5

Mfr.:

Description:
High Speed/Modular Connectors XCede(R) HD 1.80 mm High-Density Backplane Vertical Header

Lifecycle:
New Product:
New from this manufacturer.
ECAD Model:
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Availability

Stock:
Non-Stocked
Factory Lead Time:
3 Weeks Estimated factory production time.
Minimum: 1   Multiples: 1
Unit Price:
₹-.--
Ext. Price:
₹-.--
Est. Tariff:

Pricing (INR)

Qty. Unit Price
Ext. Price
₹997.89 ₹997.89
₹899.58 ₹8,995.80
₹801.27 ₹20,031.75
₹654.24 ₹54,956.16
₹586.38 ₹1,47,767.76
₹540.27 ₹2,72,296.08
₹483.72 ₹4,87,589.76
₹427.17 ₹8,61,174.72

Product Attribute Attribute Value Select Attribute
Samtec
Product Category: High Speed/Modular Connectors
Tray
Brand: Samtec
Country of Assembly: Not Available
Country of Diffusion: Not Available
Country of Origin: CN
Product Type: High Speed / Modular Connectors
Factory Pack Quantity: 42
Subcategory: Backplane Connectors
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Attributes selected: 0

USHTS:
8536694040

XCede® HD High-Density Backplane Systems

Samtec XCede® HD High-Density Backplane Systems combine a small form factor with incredible design flexibility for system and board space savings. These backplane systems allow for creating a fully custom backplane solution with guidance and keying, power modules, and sidewalls for increased durability. Samtec XCede HD backplane systems help prevent system downtime by implementing a staggered differential pin design where the ground pins mate first for hot-plugging. These backplane systems feature a 1.8mm column pitch, up to 3mm contact wipe on signal pins, and multiple signal/ground pin staging options.