EYG-R0309ZLMF

Panasonic
667-EYG-R0309ZLMF
EYG-R0309ZLMF

Mfr.:

Description:
Thermal Interface Products 92 mmx32 mmx0.25 mm250 W/m-K - 55 C+ 400 C

ECAD Model:
Download the free Library Loader to convert this file for your ECAD Tool. Learn more about the ECAD Model.

In Stock: 5

Stock:
5 Can Dispatch Immediately
Factory Lead Time:
16 Weeks Estimated factory production time for quantities greater than shown.
Minimum: 1   Multiples: 1
Unit Price:
₹-.--
Ext. Price:
₹-.--
Est. Tariff:

Pricing (INR)

Qty. Unit Price
Ext. Price
₹704.70 ₹704.70
₹629.01 ₹6,290.10
₹576.81 ₹11,536.20
₹562.89 ₹28,144.50
₹542.01 ₹54,201.00
₹519.39 ₹1,03,878.00
₹502.86 ₹2,51,430.00
₹486.33 ₹4,86,330.00
₹485.46 ₹9,70,920.00

Product Attribute Attribute Value Select Attribute
Panasonic
Product Category: Thermal Interface Products
RoHS:  
Gap Fillers / Gap Pads / Sheets
High Compressible Graphite Sheet
Non-standard
Graphite
250 W/m-K
Gray
- 55 C
+ 400 C
92 mm
32 mm
0.25 mm
600 kPa
UL 94 V-0
EYGR
Bulk
Brand: Panasonic
Country of Assembly: Not Available
Country of Diffusion: Not Available
Country of Origin: JP
Product Type: Thermal Interface Products
Factory Pack Quantity: 10
Subcategory: Thermal Management
Products found:
To show similar products, select at least one checkbox
Select at least one checkbox above to show similar products in this category.
Attributes selected: 0

CAHTS:
8545900000
USHTS:
8545904000
MXHTS:
8545909900
ECCN:
EAR99

EYG-R GraphiteTIM Pyrolytic Graphite Sheets

Panasonic EYG-R GraphiteTIM Pyrolytic Graphite Sheets (PGS) is comprised of low thermal resistance thermal management material in 250µm and 350µm thickness options. An ideal Thermal Interface Material (TIM) solution, Panasonic EYG-R GraphiteTIM material is designed with high-compressibility characteristics to reduce contact thermal resistance between rough surfaces. EYG-R GraphiteTIM material is easy to install with a one-to-two-step process that is more cost-effective than thermal grease. GraphiteTIM has very high compressibility compared to standard PGS, which reduces thermal resistance by following gap, warpage, and distortion of targets/substrates.