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ATS-MG270-R0

Name: Advanced Thermal Solutions ATS-MG270-R0
Brand: Advanced Thermal Solutions
SKU: 984-ATS-MG270-R0
Price: 666.42 INR
Availability: InStock

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Mouser No:

984-ATS-MG270-R0

Mfr. No:

ATS-MG270-R0

Mfr.:

Advanced Thermal Solutions

Description:

Heat Sinks clipKIT Attachment Heat Sink to PCB for Component Size 27x27mm, maxiGRIP Tech

Datasheet:

ATS-MG270-R0 Datasheet (PDF)

ECAD Model:

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More Information

Learn more about Advanced Thermal Solutions ATS-MG270-R0

Delivery Alerts:

This item may require additional fees and documentation. Customs delays may also occur.

In Stock: 35

Stock:: 35 Can Dispatch Immediately

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Factory Lead Time:: 8 Weeks Estimated factory production time for quantities greater than shown.

Enter Quantity:

Minimum: 1 Multiples: 1

Unit Price:

₹-.--

Ext. Price:

₹-.--

Est. Tariff:

Pricing (INR)

Qty.	Unit Price	Ext. Price
	₹666.42	₹666.42
	₹589.86	₹5,898.60
	₹562.02	₹11,240.40
	₹542.01	₹27,100.50
	₹521.13	₹52,113.00
	₹488.07	₹97,614.00
	₹475.02	₹2,37,510.00
	₹460.23	₹4,60,230.00
	₹457.62	₹9,15,240.00

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Advanced Thermal Solutions
Product Category:	Heat Sinks
Delivery Alerts:	This item may require additional fees and documentation. Customs delays may also occur.
RoHS:
Product:	Accessories and Hardware
Designed for:	Component, 27x27mm
Mounting Style:	Clip
Length:	27 mm
Width:	27 mm
Brand:	Advanced Thermal Solutions
Country of Assembly:	Not Available
Country of Diffusion:	Not Available
Country of Origin:	CN
Packaging:	Bulk
Product Type:	Heat Sinks
Series:	ATS-MG
Factory Pack Quantity:	100
Subcategory:	Heat Sinks
Tradename:	clipKIT maxiGRIP
Type:	Component

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Filter Document:

Datasheet

ATS-MG270-R0 Datasheet (PDF)

Specification Sheets

maxiGRIP™ Datasheet (PDF)

Technical Resources

Test/Quality Data

Certificate of RoHS and REACH 205 Compliance (PDF)

Videos

Heat Sink Attachments

USHTS:: 7326908688
ECCN:: EAR99

maxiGRIP™ clipKIT™ Heat Sink Attachments

Advanced Thermal Solutions maxiGRIP™ clipKIT™ Heat Sink Attachments feature a two-component system that quickly and securely mounts heat sinks to a range of hot-running Ball Grid Array (BGA) components. These attachments use a minimal amount of space on a PCB, eliminate the need to drill holes and allow the heat sink to be detached and reattached without damaging the component or PCB in the event the PCB needs to be reworked.