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ATS-KRA-3567-C1-R0

Name: Advanced Thermal Solutions ATS-KRA-3567-C1-R0
Brand: Advanced Thermal Solutions
SKU: 984-ATS-KRA-3567C1R1
Price: 3493.05 INR
Availability: InStock

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Mouser No:

984-ATS-KRA-3567C1R1

Mfr. No:

ATS-KRA-3567-C1-R0

Mfr.:

Advanced Thermal Solutions

Description:

Heat Sinks Heat Sink for AMD Xilinx Kria K26 SoM Device, Active, Straight, 54x68x10mm

Lifecycle:

New Product:

New from this manufacturer.

Datasheet:

ATS-KRA-3567-C1-R0 Datasheet (PDF)

ECAD Model:

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More Information

Learn more about Advanced Thermal Solutions ATS-KRA-3567-C1-R0

Delivery Alerts:

This item may require additional fees and documentation. Customs delays may also occur.

In Stock: 703

Stock:: 703

Can Dispatch Immediately

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On Order:: 83
Factory Lead Time:: 8

Weeks Estimated factory production time for quantities greater than shown.

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Unit Price:

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Ext. Price:

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Est. Tariff:

Pricing (INR)

Qty.	Unit Price	Ext. Price
	₹3,493.05	₹3,493.05
	₹3,220.74	₹32,207.40
	₹3,019.77	₹60,395.40
	₹2,837.07	₹1,41,853.50
	₹2,734.41	₹2,73,441.00
	₹2,603.91	₹5,20,782.00

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Advanced Thermal Solutions
Product Category:	Heat Sinks
Delivery Alerts:	This item may require additional fees and documentation. Customs delays may also occur.
RoHS:
Product:	BGA Heat Sink
Length:	54 mm
Width:	68 mm
Height:	20 mm
Brand:	Advanced Thermal Solutions
Country of Assembly:	Not Available
Country of Diffusion:	Not Available
Country of Origin:	CN
Packaging:	Tray
Product Type:	Heat Sinks
Series:	ATS-KR
Factory Pack Quantity:	100
Subcategory:	Heat Sinks
Tradename:	AMD Xilinx Kria
Unit Weight:	45 g

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CNHTS:: 8548000090
CAHTS:: 8473309000
USHTS:: 8473305100
JPHTS:: 847330090
MXHTS:: 8473300499
ECCN:: EAR99

Heat Sinks for AMD Kria™ K26 SOMs

Advanced Thermal Solutions Heat Sinks for AMD Kria™ K26 SOMs are designed to fit the K26 System-On-Module (SOM). These heatsinks are engineered to mount seamlessly to the K26 SOM’s standard heat spreader plate. These heat sinks include high-performance Thermal Interface Material (TIM) and necessary hardware and maximize heat dissipation to keep the device below critical thermal thresholds. These modules are used with AMD’s two starter kits (Robotics and Vision AI). Typical applications include robotics, industrial communications and control, retail analytics, security, smart cameras, and machine vision.